The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2023
Filed:
Aug. 17, 2021
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Lei Ma, Palo Alto, CA (US);
Wenyue Lydia Zhang, San Diego, CA (US);
Antonino Scuderi, San Diego, CA (US);
William Clinton Burling Peatman, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 27/102 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 24/13 (2013.01); H01L 27/1022 (2013.01); H01L 2224/1302 (2013.01);
Abstract
Disclosed is a semiconductor device such as a power amplifier. Unlike conventional power amplifiers, thermal bump is patterned to only cover active devices. In this way, dimensions of the semiconductor device can be reduced.