The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Aug. 17, 2017
Applicant:

Virginia Tech Intellectual Properties, Inc., Blacksburg, VA (US);

Inventors:

Maruti Hegde, Chapel Hill, NC (US);

Timothy E. Long, Blacksburg, VA (US);

Viswanath Meenakshisundaram, Santa Clara, CA (US);

Christopher B. Williams, Blacksburg, VA (US);

Nicholas Chartrain, Blacksburg, VA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C09D 11/101 (2014.01); B33Y 70/00 (2020.01); C09D 11/102 (2014.01); B33Y 10/00 (2015.01); B29C 64/135 (2017.01);
U.S. Cl.
CPC ...
C09D 11/101 (2013.01); B33Y 70/00 (2014.12); C09D 11/102 (2013.01); B29C 64/135 (2017.08); B33Y 10/00 (2014.12);
Abstract

Polymer resins for the vat photopolymerization of thermoplastics are provided, in particular for the vat photopolymerization of thermoplastics with exception thermal stability and mechanical properties. In some aspects, the polymer resins are prepared by ring opening of an aromatic dianhydride with an alcohol containing an acrylate or methacrylate to produce a photocrosslinkable diacid monomer; conversion of the photocrosslinkable diacid monomer to a photocrosslinkable diacyl chloride; and polymerization of the photocrosslinkable diacyl chloride with an aromatic diamine to produce a photocrosslinkable precursor polymer. Upon crosslinking and drying, a thermal imidization can yield aromatic polyimide polymers with high yield and with micron-scale structural resolution.


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