The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2023
Filed:
Dec. 25, 2015
Nitto Denko Corporation, Ibaraki, JP;
Daisuke Hattori, Ibaraki, JP;
Hiromoto Haruta, Ibaraki, JP;
Kozo Nakamura, Ibaraki, JP;
Kazuki Uwada, Ibaraki, JP;
Hiroyuki Takemoto, Ibaraki, JP;
Nao Murakami, Ibaraki, JP;
NITTO DENKO CORPORATION, Ibaraki, JP;
Abstract
A film is provided with void spaces having a porous structure with less cracks and a high proportion of void space as well as having strength. The film with void spaces includes one kind or two or more kinds of structural units that form a structure with minute void spaces, wherein the structural units are chemically bonded through catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The film with void spaces can be produced by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products.