The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Dec. 10, 2020
Applicant:

Elite Material Co., Ltd., Taoyuan, TW;

Inventor:

Chen-Yu Hsieh, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 283/00 (2006.01); C08F 4/80 (2006.01); C08G 61/06 (2006.01); C08L 65/00 (2006.01); C08K 3/16 (2006.01); C08G 61/02 (2006.01);
U.S. Cl.
CPC ...
C08F 283/00 (2013.01); C08F 4/80 (2013.01); C08G 61/02 (2013.01); C08K 3/16 (2013.01); C08G 61/06 (2013.01); C08G 2261/12 (2013.01); C08G 2261/3321 (2013.01); C08G 2261/3324 (2013.01); C08K 2003/164 (2013.01); C08L 65/00 (2013.01); C08L 2203/20 (2013.01);
Abstract

A prepolymer is prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction, and a resin composition includes the prepolymer. The vinyl-containing compound includes bis(vinylphenyl) ethane, divinylbenzene, modification of divinylbenzene or a combination thereof. A ratio in part by weight of the compound of Formula (I) to the vinyl-containing compound in the prepolymerization reaction is 8:2 to 6:4. The resin composition includes the prepolymer and an additive, and an article made from the resin composition may include a resin film, a prepreg, a laminate or a printed circuit board.


Find Patent Forward Citations

Loading…