The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2023
Filed:
Feb. 15, 2022
Applicant:
3m Innovative Properties Company, St. Paul, MN (US);
Inventor:
DanLi Wang, North Oaks, MN (US);
Assignee:
3M Innovative Properties Company, St. Paul, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 26/04 (2006.01); C04B 14/22 (2006.01); C04B 14/30 (2006.01); C04B 16/06 (2006.01); C04B 24/28 (2006.01); C04B 26/02 (2006.01); C04B 26/06 (2006.01); C04B 26/22 (2006.01); C04B 103/44 (2006.01); C04B 111/00 (2006.01);
U.S. Cl.
CPC ...
C04B 26/04 (2013.01); C04B 14/22 (2013.01); C04B 14/305 (2013.01); C04B 16/0625 (2013.01); C04B 16/0691 (2013.01); C04B 24/282 (2013.01); C04B 26/026 (2013.01); C04B 26/06 (2013.01); C04B 26/22 (2013.01); C04B 2103/44 (2013.01); C04B 2111/00637 (2013.01); C04B 2111/00672 (2013.01);
Abstract
A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.