The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2023
Filed:
Jul. 02, 2019
Schott Ag, Mainz, DE;
Fabian Wagner, Mainz, DE;
Volker Plapper, Alzey, DE;
Andreas Ortner, Gau-Algesheim, DE;
Simon Schmitt, Wiesbaden, DE;
Frank-Thomas Lentes, Bingen, DE;
Albrecht Seidl, Niedernberg, DE;
Antal Makacs, Grossschwabhausen, DE;
Patrick Bartholome, Jena, DE;
SCHOTT AG, Mainz, DE;
Abstract
A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (σ) for separating the substrate along the separation line is smaller than a first reference stress (σ) of the substrate and such that an edge strength σof the separation edge obtained after separation is greater than a second reference stress (σ) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.