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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11618252 B1

PDFFull Text
Date of Patent:
Apr. 04, 2023

Filed:

Jan. 06, 2021

Liquid jetting apparatus and wiring member

Applicant:

Brother Kogyo Kabushiki Kaisha, Nagoya, JP;

Inventor:

Toru Yamashita, Nagoya, JP;

Assignee:

Brother Kogyo Kabushiki Kaisha, Nagoya, JP;

Attorney:

Banner & Witcoff, Ltd.

Primary Examiner:

Kristal Feggins

Int. Cl.
CPC ...
B41J 2/045 (2006.01); B41J 2/14 (2006.01); H01L 23/50 (2006.01); H01L 23/528 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
B41J 2/04541 (2013.01); B41J 2/04581 (2013.01); B41J 2/14201 (2013.01); B41J 2/14233 (2013.01); H01L 23/50 (2013.01); H01L 23/5286 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 25/0655 (2013.01); B41J 2002/14241 (2013.01); B41J 2002/14491 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15323 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/351 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A liquid jetting apparatus includes: a head unit including a first driving element, a second driving element, a first contact portion connected to the first driving element, and a second contact portion connected to the second driving element; and a wiring member including a flexible substrate, a first driving IC provided on the flexible substrate, a second driving IC provided on the flexible substrate, a first wire formed in the flexible substrate and connecting the first driving IC and the first contact portion, and a second wire formed in the flexible substrate and connecting the second driving IC and the second contact portion. A conductive part different from the first wire and the second wire is disposed in an area of the flexible substrate between the first driving IC and the second driving IC.

Find Patent Forward Citations

Yamashita, Toru. (2023). Liquid jetting apparatus and wiring member (U.S. Patent No. 11618252). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11618252

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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