The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Feb. 05, 2021
Applicant:

Composecure, Llc, Somerset, NJ (US);

Inventors:

Adam Lowe, Somerset, NJ (US);

John Esau, Marlboro, NJ (US);

Assignee:

CompoSecure, LLC, Somerset, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); G06K 19/077 (2006.01); H01Q 13/10 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); B22D 19/00 (2006.01); B29C 45/17 (2006.01); B29L 17/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14647 (2013.01); B22D 19/00 (2013.01); B29C 45/14 (2013.01); B29C 45/14639 (2013.01); B29C 45/17 (2013.01); G06K 19/077 (2013.01); G06K 19/07745 (2013.01); G06K 19/07749 (2013.01); G06K 19/07777 (2013.01); H01Q 13/10 (2013.01); H05K 1/18 (2013.01); H05K 3/284 (2013.01); H05K 3/285 (2013.01); H05K 3/301 (2013.01); B29L 2017/006 (2013.01); H05K 2201/1003 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract

A transaction device includes a metal layer with one or more discontinuities in the metal layer. Each discontinuity comprises a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity that defines a path from the device periphery to the opening. A transponder chip module is disposed in the opening. A booster antenna is in communication with the transponder chip module. The device may include at least one fiber-reinforced epoxy laminate material layer. The transponder chip module and the booster antenna may comprise components in a payment circuit, with the metal layer electrically isolated from the payment circuit. The booster antenna may be formed on or embedded in the fiber-reinforced epoxy laminate material layer. Processes for manufacturing transaction devices including a metal layer with one or more fiber-reinforced epoxy laminate material layers are also disclosed.


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