The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Feb. 24, 2020
Applicant:

Lpkf Laser & Electronics Ag, Garbsen, DE;

Inventors:

Robin Alexander Krueger, Hannover, DE;

Norbert Ambrosius, Kevelaer, DE;

Roman Ostholt, Langenhagen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/382 (2014.01); B23K 26/0622 (2014.01); B23K 26/00 (2014.01); H01L 21/48 (2006.01); B23K 26/53 (2014.01); B23K 26/064 (2014.01); B23K 26/402 (2014.01); B23K 103/00 (2006.01); H01L 23/498 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/382 (2015.10); B23K 26/0006 (2013.01); B23K 26/064 (2015.10); B23K 26/0624 (2015.10); B23K 26/402 (2013.01); B23K 26/53 (2015.10); H01L 21/486 (2013.01); B23K 2101/40 (2018.08); B23K 2103/50 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01);
Abstract

A device for modifying a region of a substrate includes a laser radiation source for pulsed laser radiation. A transmissive medium having a higher intensity-dependent refraction index than air is arranged between a laser machining head and the substrate such that an individual pulse of the pulsed laser radiation from the laser machining head is deflected through the transmissive medium and across a thickness of the substrate from an original focal depth to a focal depth different from the original focal depth to modify the substrate along a beam axis of the laser radiation in a region of a recess or through-opening to be formed in the substrate without removing an amount of the substrate material necessary to form the recess or through-opening. A length between the focal depths is greater than and extends across the thickness of the substrate.


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