The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Jul. 21, 2017
Applicant:

Shenzhen Cas-envision Medical Technology Co., Ltd, Shenzhen, CN;

Inventors:

Tianzhun Wu, Shenzhen, CN;

Saisai Zhao, Shenzhen, CN;

Ye Feng, Shenzhen, CN;

Chunlei Yang, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); A61N 1/36 (2006.01); A61F 2/14 (2006.01); B05D 1/00 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); A61J 1/00 (2023.01); A61F 2/00 (2006.01); A61N 1/05 (2006.01);
U.S. Cl.
CPC ...
A61N 1/37512 (2017.08); A61F 2/0095 (2013.01); A61F 2/14 (2013.01); A61J 1/00 (2013.01); A61N 1/05 (2013.01); A61N 1/36038 (2017.08); A61N 1/375 (2013.01); A61N 1/3758 (2013.01); B05D 1/60 (2013.01); C23C 16/403 (2013.01); C23C 16/45525 (2013.01);
Abstract

An implantable medical device having a package, including: a device body, and a package configured for packaging the device body. The package includes at least one organic film layer and at least one inorganic film layer that are stacked on one another. An innermost layer of the package is an organic film layer or an inorganic film layer, and an outermost layer of the package is an organic film layer or an inorganic film layer. Each organic film layer is a parylene film or polyimide resin film with biocompatibility, and each inorganic film layer is an inorganic film with biocompatibility. A method for packaging an implantable medical device is also provided.


Find Patent Forward Citations

Wu, Tianzhun. (2023). Implantable medical device having package and method for packaging implantable medical device (U.S. Patent No. 11617891). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11617891

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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