The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Sep. 02, 2019
Applicant:

Altek Biotechnology Corporation, Hsinchu, TW;

Inventors:

Hsi-Hsin Loo, Hsinchu, TW;

Parn-Far Chen, Hsinchu, TW;

Liang-Yi Li, Hsinchu, TW;

Chao-Yu Chou, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 43/02 (2006.01); H01R 12/53 (2011.01); A61B 1/06 (2006.01); A61B 1/05 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01R 43/02 (2013.01); A61B 1/05 (2013.01); A61B 1/0661 (2013.01); H01R 12/53 (2013.01); H05K 3/34 (2013.01);
Abstract

An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.


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