The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2023
Filed:
Feb. 24, 2021
Hewlett Packard Enterprise Development Lp, Houston, TX (US);
Kevin B. Leigh, Houston, TX (US);
John Norton, Houston, TX (US);
Hewlett Packard Enterprise Development LP, Spring, TX (US);
Abstract
Example implementations relate to an electrical socket for an electronic packaging assembly, which accepts a modular integrated circuit (IC) on one side and a circuit board on another side. In some examples, the electrical socket has a first body mountable on a first surface of the circuit board and a second body mountable on a second surface of the circuit board. The first body includes a plurality of conductors (wire-terminated contacts), where each first conductor includes a first end to protrude beyond the first surface of the circuit board and a second end to protrude beyond the second surface of the circuit board. The second body includes a plurality of receptacles, where each receptacle is coupled to the second end of a respective first conductor.