The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Jan. 15, 2019
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jungho Ahn, Gyeonggi-do, KR;

Kiyoung Kwon, Gyeonggi-do, KR;

Boram Namgoong, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/27 (2006.01); H01Q 21/28 (2006.01); G01S 3/46 (2006.01); G01S 3/48 (2006.01); H01Q 5/378 (2015.01); H01Q 5/25 (2015.01); H01Q 1/24 (2006.01); G04G 17/08 (2006.01); G04G 21/04 (2013.01); G06F 1/16 (2006.01); H01Q 1/38 (2006.01); H01Q 5/30 (2015.01); G06F 3/0488 (2022.01);
U.S. Cl.
CPC ...
H01Q 1/273 (2013.01); G01S 3/46 (2013.01); G01S 3/48 (2013.01); G04G 17/08 (2013.01); G04G 21/04 (2013.01); G06F 1/163 (2013.01); H01Q 1/24 (2013.01); H01Q 1/38 (2013.01); H01Q 5/25 (2015.01); H01Q 5/378 (2015.01); H01Q 21/28 (2013.01); G06F 3/0488 (2013.01); H01Q 5/30 (2015.01);
Abstract

An electronic device includes a housing including a front surface plate, a rear surface plate facing a direction opposite the front surface plate, and a side surface member surrounding a space between the front surface plate and the rear surface plate; at least one attachment member coupled to the side surface member, and removably fastened to a human body, the at least one attachment member including a first attachment member coupled to at least part of the side surface member, and a second attachment member coupled to a position of the side surface member facing the first attachment member; a substrate arranged in the space in parallel with the front surface plate; at least one wireless communication circuit arranged on the substrate; a first conductive pattern electrically connected with the wireless communication circuit, and arranged on the side surface member in proximity to the first attachment member; a second conductive pattern arranged on the side surface member in proximity to the second attachment member; a first conductive member arranged in the first attachment member in proximity to the first conductive pattern to be capacitively coupled with the first conductive pattern; and a second conductive member arranged in the second attachment member in proximity to the second conductive pattern to be capacitively coupled with the second conductive pattern.


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