The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2023
Filed:
Feb. 19, 2016
Hitachi, Ltd., Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Proposed is a novel embedded structure for suppressing a disturbance in the cross sectional shape and a non-uniform deformation of a metal member arising in a precursor when producing an MgB2 multi-core wire material by a surface reduction process. This superconductive multi-core wire material precursor is characterized by having: soft Cu and Fe pure metals disposed in the center; mixed powder elements, each comprising as a sheath material a metal such as Fe or Nb having a barrier effect preventing a reaction between Mg and Cu, the mixed powder elements being disposed in a form that surrounds the periphery of the soft metal serving as the central material; and disposed around these, an outer shell layer produced from a harder metal than the central material and the sheath material.