The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2023
Filed:
May. 17, 2018
Applicant:
Nitto Denko Corporation, Ibaraki, JP;
Inventor:
Naoki Sadayori, Ibaraki, JP;
Assignee:
NITTO DENKO CORPORATION, Ibaraki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 35/18 (2006.01); H01L 35/22 (2006.01); H01L 35/26 (2006.01); H01L 35/24 (2006.01); H01L 35/28 (2006.01); C01B 33/06 (2006.01); H01L 35/34 (2006.01); B28B 11/24 (2006.01); B22F 3/10 (2006.01); B22F 3/105 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
H01L 35/18 (2013.01); B22F 3/1003 (2013.01); B22F 3/105 (2013.01); B28B 11/243 (2013.01); C01B 33/06 (2013.01); H01L 35/22 (2013.01); H01L 35/24 (2013.01); H01L 35/26 (2013.01); H01L 35/28 (2013.01); H01L 35/34 (2013.01); B82Y 30/00 (2013.01); C01P 2002/54 (2013.01); C01P 2002/60 (2013.01); C01P 2004/04 (2013.01); C01P 2004/61 (2013.01); C01P 2006/32 (2013.01); C01P 2006/40 (2013.01);
Abstract
A semiconductor sintered body comprising a polycrystalline body, wherein the polycrystalline body includes silicon or a silicon alloy, wherein the average grain size of the crystal grains forming the polycrystalline body is 1 μm or less, and wherein nanoparticles including one or more of a carbide of silicon, a nitride of silicon, and an oxide of silicon are present at a grain boundary of the grains.