The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Feb. 11, 2020
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Liang Chen, Beijing, CN;

Lei Wang, Beijing, CN;

Minghua Xuan, Beijing, CN;

Li Xiao, Beijing, CN;

Dongni Liu, Beijing, CN;

Detao Zhao, Beijing, CN;

Hao Chen, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/167 (2013.01); H01L 33/62 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/81085 (2013.01); H01L 2224/81139 (2013.01); H01L 2224/81143 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A chip transfer method including: disposing a target substrate in a closed cavity, the target substrate including a first alignment bonding structure and a second alignment bonding structure; applying a charge of a first polarity to the first alignment bonding structure of the target substrate; applying a charge of a second polarity to a first chip bonding structure of a chip; injecting an insulating fluid into the closed cavity to suspend the chip in the insulating fluid within the closed cavity; and applying a bonding force to the chip.


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