The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2023
Filed:
Jan. 20, 2021
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Daniel Maurer, Feld am See, AT;
Christof Altstaetter, Gaimberg, AT;
Thomas Beyreder, Villach, AT;
Oliver Blank, Villach, AT;
Jürgen Bostjancic, Ludmannsdorf, AT;
Andreas Kleinbichler, Villach, AT;
Josef Liegl, Kappel am Krappfeld, AT;
Nicole Schulze-Ollmert, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); G01R 31/2891 (2013.01); H01L 24/03 (2013.01); H01L 2224/0217 (2013.01); H01L 2224/03015 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05193 (2013.01);
Abstract
A semiconductor device includes a semiconductor substrate having a main surface over which a plurality of die pads and at least one alignment pad for optical process control for semiconductor wafer probing are arranged. The alignment pad has a hardness smaller than a hardness of the plurality of die pads.