The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Nov. 30, 2021
Applicant:

Southern University of Science and Technology, ShenZhen, CN;

Inventors:

Guobiao Zhang, Corvallis, OR (US);

Hongyu Yu, ShenZhen, CN;

Shengming Zhou, ShenZhen, CN;

Yuejin Guo, ShenZhen, CN;

Kai Chen, ShenZhen, CN;

Yida Li, ShenZhen, CN;

Jun Lan, ShenZhen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/642 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 28/92 (2013.01); H01L 2221/68372 (2013.01);
Abstract

A method for making a three-dimensional (3-D) module includes the steps of: A) forming a laminate of alternate ceramic tape layers and internal electrode layers on a substrate; B) etching said laminate to form first and second capacitor stacks at said first and second locations; C) firing said first and second capacitor stacks integrally; D) forming first and second pairs of external electrodes on said first and second capacitor stacks, respectively.


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