The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Dec. 03, 2021
Applicant:

Microchip Technology Inc., Chandler, AZ (US);

Inventors:

Amaury Gendron-Hansen, Bend, OR (US);

Bruce Odekirk, Bend, OR (US);

Assignee:

Microchip Technology Inc., Chandler, AZ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/04 (2006.01); H01L 27/092 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02378 (2013.01); H01L 21/02274 (2013.01); H01L 21/02293 (2013.01); H01L 21/02579 (2013.01); H01L 21/0465 (2013.01); H01L 21/0475 (2013.01); H01L 21/67075 (2013.01); H01L 27/0927 (2013.01);
Abstract

A silicon carbide semiconductor device includes a silicon carbide (SiC) substrate having a SiC epitaxial layer disposed over a surface of the SiC substrate, the SiC substrate having a first conductivity and the SiC epitaxial layer having the first conductivity. A contact region and a well region are formed in the SiC epitaxial layer, the contact region and the well region have a doping level of a second conductivity opposite the first conductivity. The contact region lies completely within the well region, is not in contact with a region having the first conductivity and has edges recessed from edges of the well region.


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