The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

May. 30, 2018
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Catherine Trent, Allen, TX (US);

Gary A. Frazier, Garland, TX (US);

Kyle L. Grosse, Dallas, TX (US);

Assignee:

RAYTHEON COMPANY, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/00 (2006.01); C23C 14/10 (2006.01); C23C 14/22 (2006.01); C23C 14/24 (2006.01); C23C 14/34 (2006.01); C25D 7/00 (2006.01); H01F 41/18 (2006.01); H01F 41/26 (2006.01);
U.S. Cl.
CPC ...
H01F 1/0045 (2013.01); C23C 14/10 (2013.01); C23C 14/223 (2013.01); C23C 14/24 (2013.01); C23C 14/34 (2013.01); C25D 7/001 (2013.01); C25D 7/006 (2013.01); H01F 41/18 (2013.01); H01F 41/26 (2013.01);
Abstract

A virtual adhesion method is provided. The virtual adhesion method includes increasing a magnetic characteristic of an initial structure, supporting the initial structure on a surface of a substrate, generating a magnetic field directed such that the initial structure is forced toward the surface of the substrate and forming an encapsulation, which is bound to exposed portions of the surface, around the initial structure.


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