The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

May. 06, 2022
Applicant:

Deako, Inc., Seattle, WA (US);

Inventors:

Derek Richardson, Seattle, WA (US);

Patrick Prendergast, Clinton, WA (US);

Cole Wilson, Auburn, WA (US);

Erik Anderson, Shoreline, WA (US);

Dana Olson, Kirkland, WA (US);

Assignee:

DEAKO, INC., Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/20 (2022.01); G06V 20/52 (2022.01); G06F 3/01 (2006.01); H05B 47/19 (2020.01); G06V 40/13 (2022.01); H05B 47/105 (2020.01); H01R 13/447 (2006.01); G06V 40/16 (2022.01); H02G 3/08 (2006.01); H02G 3/12 (2006.01); H01R 13/627 (2006.01); H01R 107/00 (2006.01); H01R 13/24 (2006.01); G05B 19/048 (2006.01); H01R 12/72 (2011.01); H01R 24/62 (2011.01); H02G 3/16 (2006.01);
U.S. Cl.
CPC ...
G06V 20/52 (2022.01); G06F 3/017 (2013.01); G06V 40/13 (2022.01); G06V 40/161 (2022.01); G06V 40/23 (2022.01); H01R 13/447 (2013.01); H05B 47/105 (2020.01); H05B 47/19 (2020.01); G05B 19/048 (2013.01); G05B 2219/25011 (2013.01); H01R 12/724 (2013.01); H01R 13/2407 (2013.01); H01R 13/6275 (2013.01); H01R 24/62 (2013.01); H01R 2107/00 (2013.01); H02G 3/081 (2013.01); H02G 3/12 (2013.01); H02G 3/16 (2013.01);
Abstract

In one embodiment, a configurable system may be capable of verification and include a modular control unit configured to control power. The modular control unit may include a first contact element configured to receive the power, a backplate, and at least one device control assembly. Other embodiments may include a system configured for dynamically assignable pairings. Further embodiments may include a backplate configured to control power to at least one load device, the backplate including one or more power control elements. Additional embodiments may include a system including a receptacle. The system with the receptacle may include a modular control unit, a backplate, a contact element, and at least one device control assembly configured to be removably coupled to the backplate.


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