The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2023
Filed:
Apr. 25, 2022
Sensei, Inc., Sunnyvale, CA (US);
John Aaron Zarraga, San Francisco, CA (US);
Alexander Meagher Grau, Durham, NC (US);
Bethany Noel Haniger, Los Gatos, CA (US);
Bradley James Bozarth, Moore, SC (US);
Brogan Carl Miller, Mountain View, CA (US);
Ilya Daniel Rosenberg, Mountain View, CA (US);
James Frank Thomas, Danville, CA (US);
Mark Joshua Rosenberg, Sunnyvale, CA (US);
Peter Hans Nyboer, San Jose, CA (US);
Reuben Eric Martinez, Gilroy, CA (US);
Scott Gregory Isaacson, Mountain View, CA (US);
Stephanie Jeanne Oberg, Sunnyvale, CA (US);
Timothy James Miller, Half Moon Bay, CA (US);
Tomer Moscovich, San Francisco, CA (US);
Yibo Yu, Santa Clara, CA (US);
Sensel, Inc., Sunnyvale, CA (US);
Abstract
The present invention relates to touch sensor detector systems and methods incorporating an interpolated variable impedance touch sensor array and specifically to such systems and methods for gesture recognition and associating a UI element with the recognized gesture. In one embodiment, the present invention provides a variable impedance array (VIA) system for receiving a gesture that includes: a plurality of physical VIA columns connected by interlinked impedance columns; a plurality of physical VIA rows connected by interlinked impedance rows; and a processor configured to interpolate a location and/or pressure of the gesture in the physical columns and rows from an electrical signal from a plurality of column drive sources (connected to the plurality of physical VIA columns through the interlinked impedance columns) sensed at a plurality of row sense sinks (connected to the plurality of physical VIA rows through the interlinked impedance rows).