The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Mar. 02, 2018
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Naoki Komai, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); G02B 13/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
G02B 13/0085 (2013.01); H01L 27/14603 (2013.01); H01L 27/14687 (2013.01); H01L 27/14685 (2013.01); H04N 5/2254 (2013.01); H04N 5/2257 (2013.01);
Abstract

There is provided a camera module including a first lens substrate having a light-incident side. The first lens substrate includes a lens disposed at an inner side of a through-hole of the first lens substrate, and a wiring layer disposed at an opposite side of the light-incident side of the first lens substrate. The camera module may include an imaging element including a pixel array disposed at a light-incident side of a substrate, where the imaging element is electrically connected to the wiring layer of the first lens substrate, and where a width of the imaging element in a direction parallel to the light-incident surface of the imaging element is smaller than a width of the first lens substrate in the direction parallel to the light-incident surface of the first lens substrate.


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