The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2023
Filed:
Oct. 24, 2019
International Business Machines Corporation, Armonk, NY (US);
Hongqing Zhang, Hopewell Junction, NY (US);
Jay A. Bunt, Esopus, NY (US);
David J. Lewison, LaGrangeville, NY (US);
Joyce Molinelli Acocella, Poughquag, NY (US);
Yu Luo, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Aspects of the invention include a non-destructive bond line thickness measurement of thermal interface material on silicon packages. A non-limiting example computer-implemented method includes receiving a chip mounted on a laminate and depositing a high-density material on the chip. The computer-implemented method deposits a thermal interface material on the chip and lids the chip, and the laminate with a lid. The computer-implemented method X-rays the lid, the chip, and the laminate to produce an X-ray and measures, using a processor, from the X-ray a bond line thickness of the TIM as a distance from a bottom of the lid to a top surface of the high-density material.