The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Feb. 27, 2020
Applicant:

Suzhou Shinhao Materials Llc, Suzhou, CN;

Inventors:

Yun Zhang, Suzhou, CN;

Jing Wang, Suzhou, CN;

Zifang Zhu, Nujiang, CN;

Tao Ma, Suzhou, CN;

Luming Chen, Suzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C25D 3/38 (2006.01); C30B 28/04 (2006.01); C30B 29/02 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); B32B 15/01 (2013.01); C30B 28/04 (2013.01); C30B 29/02 (2013.01); B32B 2307/704 (2013.01); B32B 2311/12 (2013.01);
Abstract

An electroplating copper layer includes bamboo-like copper crystal particles having a highly preferred orientation. The bamboo-like copper crystal particles have a long axis direction and a short axis direction, and the bamboo-like copper crystal particles have a length of 20 nm to 5 μm in the long axis direction and a length of 20 nm to 2 μm in the short axis direction. The bamboo-like copper crystal particles have a uniform particle size, and the electroplating copper layer has a major diffraction peak at a 2θ angle of about 44°.


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