The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Apr. 08, 2019
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Takayuki Hiratani, Tokyo, JP;

Kyohei Wada, Fuchu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C09D 11/102 (2014.01); C09D 11/101 (2014.01); B29C 64/291 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B29K 71/00 (2006.01); B29K 33/00 (2006.01); B29K 9/00 (2006.01); B29K 63/00 (2006.01);
U.S. Cl.
CPC ...
C09D 11/102 (2013.01); B29C 64/291 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C09D 11/101 (2013.01); B29K 2009/00 (2013.01); B29K 2033/12 (2013.01); B29K 2063/00 (2013.01); B29K 2071/00 (2013.01);
Abstract

A curable resin composition includes: an oxetane compound (A) having one oxetanyl group as a cationic polymerizable reactive group and at least one hydroxyl group; a cationic polymerizable compound (B) which is a cationic polymerizable compound other than the oxetane compound (A) and has two or more cationic polymerization reactive groups; a rubber particle (C); and a curing agent (D), wherein the oxetane compound (A) is contained at 30 parts by mass or more and 60 parts by mass or less, based on 100 parts by mass of total mass of the oxetane compound (A) and the cationic polymerizable compound (B), and the rubber particle (C) has a group capable of reacting with the oxetane compound (A) or the cationic polymerizable compound (B) on a surface of the rubber particle (C).


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