The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Mar. 21, 2018
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Maria del Carmen Querol Esparch, Sant Cugat del Valles, ES;

Laurent Herschke, Sant Cugat del Valles, ES;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 53/00 (2006.01); B33Y 70/00 (2020.01); C08K 3/34 (2006.01); B33Y 70/10 (2020.01); B29C 64/165 (2017.01); B29K 23/00 (2006.01); B29K 96/04 (2006.01);
U.S. Cl.
CPC ...
C08L 53/00 (2013.01); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); C08K 3/346 (2013.01); B29C 64/165 (2017.08); B29K 2023/14 (2013.01); B29K 2096/04 (2013.01);
Abstract

This disclosure describes compositions, kits, methods, systems, and three-dimensional parts. According to an example, described herein is a three-dimensional printed part made from three-dimensional printing, the three-dimensional part comprising: a thermoplastic polymer powder composition comprising a mixture of two or more polyolefins including at least 60 wt % of a C3 polyolefin based on the total weight of the mixture of the two or more polyolefins, wherein the thermoplastic polymer powder composition has a processing window of from about 120° C. to about 150° C.


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