The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Aug. 17, 2020
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

Jamu K. Alford, Ham Lake, MN (US);

Spencer Fodness Bondhus, Columbia Heights, MN (US);

Michael Kalm, Spring Lake Park, MN (US);

James M. Olsen, Plymouth, MN (US);

Brian T. Stolz, Bloomington, MN (US);

Richard T. Stone, Minneapolis, MN (US);

Bryan D. Stem, Minneapolis, MN (US);

John D. Welter, Plymouth, MN (US);

Assignee:

MEDTRONIC, INC., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/05 (2006.01); A61N 1/08 (2006.01);
U.S. Cl.
CPC ...
A61N 1/05 (2013.01); A61N 1/086 (2017.08);
Abstract

Conductors within an implantable medical lead that carry stimulation signal signals are at least partially embedded within a lead body of the medical lead over at least a portion of the length of the conductors while being surrounded by a radio frequency (RF) shield. A space between the shield and the conductors is filled by the presence of the lead body material such that body fluids that infiltrate the lead over time cannot pool in the space between the shield and the conductors. The dielectric properties of the lead body are retained and the capacitive coupling between the shield and the conductors continues to be inhibited such that current induced on the shield is inhibited from being channeled onto the conductors. Heating at the electrodes of the medical lead is prevented from becoming excessive.


Find Patent Forward Citations

Loading…