The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2023

Filed:

Aug. 10, 2021
Applicant:

Marvell Asia Pte, Ltd., Singapore, SG;

Inventors:

Radhakrishnan L. Nagarajan, Santa Clara, CA (US);

Liang Ding, Singapore, SG;

Mark Patterson, Santa Clara, CA (US);

Roberto Coccioli, Santa Clara, CA (US);

Steve Aboagye, Santa Clara, CA (US);

Assignee:

MARVELL ASIA PTE LTD., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G02B 6/42 (2006.01); H01L 23/427 (2006.01); H01L 25/16 (2023.01); H04Q 11/00 (2006.01); G02B 6/43 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20672 (2013.01); G02B 6/428 (2013.01); G02B 6/4269 (2013.01); G02B 6/43 (2013.01); H01L 23/427 (2013.01); H01L 25/167 (2013.01); H04Q 11/0005 (2013.01); H05K 7/2039 (2013.01); H05K 7/20154 (2013.01); H05K 7/20572 (2013.01);
Abstract

An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.


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