The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2023
Filed:
Jun. 01, 2021
Applicants:
Kunal Shah, Bothell, WA (US);
Purvi Shah, Bothell, WA (US);
Inventors:
Kunal Shah, Bothell, WA (US);
Purvi Shah, Bothell, WA (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/28 (2006.01); H05K 1/11 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 3/285 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 3/24 (2013.01); H05K 2201/0218 (2013.01); H05K 2201/0224 (2013.01); H05K 2201/0335 (2013.01);
Abstract
A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish.