The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2023
Filed:
Mar. 15, 2021
Applicant:
Hyundai Mobis Co., Ltd., Seoul, KR;
Inventors:
Myeong Nam Woo, Yongin-si, KR;
Uhn Yong Shin, Yongin-si, KR;
Assignee:
Hyundai Mobis Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); B60R 13/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); B60R 13/0212 (2013.01); B60R 2013/0287 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10151 (2013.01);
Abstract
A module assembly is attached on a headlining of a vehicle and includes a base where an upper portion thereof is open, a first printed circuit board (PCB) and a second PCB sequentially stacked on a plurality of supporting pillars extending in a vertical direction to an inner bottom surface of the base and electrically connected to each other by a flexible cable, and a cover assembled with the base to cover the first and second PCBs stacked on the base.
Quick Actions:
Woo, Myeong. (2023). Module assembly mounted on headlining of vehicle (U.S. Patent No. 11612058). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11612058
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile