The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2023
Filed:
Feb. 19, 2018
Applicants:
National Institute of Advanced Industrial Science and Technology, Tokyo, JP;
Photonics Electronics Technology Research Association, Tokyo, JP;
Inventors:
Takeru Amano, Ibaraki, JP;
Akihiro Noriki, Ibaraki, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); G02B 6/43 (2006.01); H01S 5/022 (2021.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0232 (2013.01); G02B 6/43 (2013.01); H01S 5/022 (2013.01); H01L 27/15 (2013.01);
Abstract
A circuit board () has a first surface (). A semiconductor chip () (first semiconductor chip) is located at the first surface side () of the circuit board (). An insulating layer () covers the first surface () of the circuit board () and the semiconductor chip (). A conductive path () (first conductive path) is electrically connected to the semiconductor chip () and extends in the insulating layer (). A waveguide () is optically coupled to the semiconductor chip () and extends in the insulating layer ().