The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11610935 B1

Date of Patent:

Mar. 21, 2023

Filed:

Mar. 26, 2020

Fan-out light-emitting diode (led) device substrate with embedded backplane, lighting system and method of manufacture

Applicant:

Lumileds Llc, San Jose, CA (US);

Inventors:

Tze Yang Hin, Cupertino, CA (US);

Qing Xue, Santa Clara, CA (US);

Assignee:

Lumileds LLC, San Jose, CA (US);

Attorney:

Volpe Koenig

Primary Examiner:

Ratisha Mehta

Int. Cl.

CPC ...

H01L 27/15 (2006.01); H01L 21/768 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 21/48 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 21/60 (2006.01);

U.S. Cl.

CPC ...

H01L 27/153 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/6836 (2013.01); H01L 21/76805 (2013.01); H01L 21/76877 (2013.01); H01L 21/78 (2013.01); H01L 24/81 (2013.01); H01L 27/156 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); H01L 2021/60067 (2013.01); H01L 2021/60135 (2013.01); H01L 2224/81815 (2013.01); H01L 2933/0066 (2013.01);

Abstract

Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.

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