The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2023
Filed:
Sep. 26, 2020
AU Optronics Corporation, Hsinchu, TW;
Hsiang-Chi Cheng, Hsinchu, TW;
Yi-Cheng Lai, Hsinchu, TW;
Sin-Jie Wang, Hsinchu, TW;
Shyh-Bin Kuo, Hsinchu, TW;
Kuo-Hsiang Chen, Hsinchu, TW;
Yu-Chih Wang, Hsinchu, TW;
Chung-Hung Chen, Hsinchu, TW;
Au Optronics Corporation, Hsinchu, TW;
Abstract
A chip is provided. The chip includes a flexible substrate, a plurality of thin-film transistors, a redistribution layer, a first power rail layer, and a second power rail layer. The plurality of thin-film transistors are disposed on the flexible substrate. The redistribution layer is disposed above the plurality of thin-film transistors. The first power rail layer is disposed above the redistribution layer. The first power rail layer provides a first voltage to the plurality of thin-film transistors. The second power rail layer is disposed above the first power rail layer. The second power rail layer provides a second voltage to the plurality of thin-film transistors, wherein the second power rail layer is disposed in a grid shape.