The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2023

Filed:

Aug. 12, 2019
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuto Shiga, Tokyo, JP;

Hajime Kato, Tokyo, JP;

Kazuya Tobita, Tokyo, JP;

Youichi Kazuta, Tokyo, JP;

Noriaki Hamachi, Tokyo, JP;

Makoto Yoshino, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01F 27/30 (2006.01); H01F 41/04 (2006.01); H01F 41/10 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01F 27/306 (2013.01); H01F 41/041 (2013.01); H01F 41/10 (2013.01); H01F 2017/0073 (2013.01);
Abstract

An electronic component includes an element provided with a recess, a mounting conductor disposed in the recess, and an internal conductor disposed inside the element and connected to the mounting conductor. A first region includes a first surface. A second region includes a third surface connecting a second surface and the first surface. The second surface and the third surface overlap with the first surface as viewed in a direction in which the first surface and the second surface face each other. The internal conductor is connected to the second region away from a connection portion between the first surface and the third surface.


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