The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2023

Filed:

Sep. 17, 2019
Applicants:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Stmicroelectronics (Research & Development) Limited, Marlow, GB;

Inventors:

Nicolas Mastromauro, Lumbin, FR;

Roy Duffy, Edinburgh, GB;

Karine Saxod, Les Marches, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 31/0203 (2014.01); G02B 7/00 (2021.01); G02B 13/00 (2006.01);
U.S. Cl.
CPC ...
G02B 7/006 (2013.01); G02B 13/00 (2013.01); H01L 31/0203 (2013.01); H01L 31/02325 (2013.01);
Abstract

An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.


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