The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2023

Filed:

Feb. 15, 2019
Applicant:

Agc Inc., Chiyoda-ku, JP;

Inventors:

Tatsuzo Miyagoe, Tokyo, JP;

Teruo Fujiwara, Tokyo, JP;

Assignee:

AGC INC., Chiyoda-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); G02B 1/115 (2015.01); B32B 9/00 (2006.01); B32B 17/10 (2006.01); C03C 17/34 (2006.01); G02B 1/11 (2015.01);
U.S. Cl.
CPC ...
G02B 1/115 (2013.01); B32B 7/12 (2013.01); B32B 9/00 (2013.01); B32B 17/10165 (2013.01); B32B 17/10201 (2013.01); B32B 17/10798 (2013.01); C03C 17/3417 (2013.01); G02B 1/11 (2013.01); B32B 2457/202 (2013.01); C03C 2217/213 (2013.01); C03C 2217/218 (2013.01); C03C 2217/734 (2013.01); C03C 2218/154 (2013.01);
Abstract

The present invention provides a laminate that can eliminate adsorption defects of a substrate caused by warping of the substrate and enables electronic devices to be manufactured at high yield. The present invention pertains to a laminate that is provided with a support base material, an adhesion layer, and a substrate in said order. The substrate is provided with a dielectric multilayer film in which dielectric layers having different refractive indexes are alternately laminated on an outer surface of the substrate. The substrate provided with the dielectric multilayer film is disposed on the adhesion layer such that the dielectric multilayer film adheres in a peelable manner to the adhesion layer.


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