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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11608435 B1

PDFFull Text
Date of Patent:
Mar. 21, 2023

Filed:

May. 30, 2018

Epoxy resin composition, electronic component mounting structure, and method for producing the same

Applicant:

Nagase Chemtex Corporation, Osaka, JP;

Inventors:

Yasuhito Fujii, Tatsuno, JP;

Katsushi Kan, Tatsuno, JP;

Yosuke Oi, Tatsuno, JP;

Assignee:

NAGASE CHEMTEX CORPORATION, Osaka, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/29 (2006.01); C08L 63/00 (2006.01); C09J 163/00 (2006.01); C08K 3/36 (2006.01); C08K 7/26 (2006.01); C08L 63/04 (2006.01); B29C 43/00 (2006.01); B29K 63/00 (2006.01); C08G 59/42 (2006.01); C08K 5/18 (2006.01);
U.S. Cl.
CPC ...
C08L 63/04 (2013.01); B29C 43/003 (2013.01); C08K 3/36 (2013.01); C08K 7/26 (2013.01); C08L 63/00 (2013.01); C09J 163/00 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); H01L 23/295 (2013.01); B29K 2063/00 (2013.01); C08G 59/4238 (2013.01); C08K 5/18 (2013.01); C08K 2201/003 (2013.01); C08L 2201/08 (2013.01); C08L 2203/206 (2013.01);
Abstract

To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mmarea is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

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