The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2023

Filed:

Jan. 16, 2018
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Akihiro Endo, Annaka, JP;

Yasuhisa Ishihara, Annaka, JP;

Hisaharu Yamaguchi, Annaka, JP;

Masahiro Moteki, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 7/04 (2020.01); B29C 35/02 (2006.01); B32B 27/20 (2006.01); C08K 3/20 (2006.01); C08K 3/22 (2006.01); H01L 23/373 (2006.01); C08J 7/043 (2020.01); C08J 7/044 (2020.01); B32B 27/28 (2006.01); B29K 83/00 (2006.01);
U.S. Cl.
CPC ...
C08J 7/0427 (2020.01); B29C 35/02 (2013.01); B32B 27/283 (2013.01); C08J 7/043 (2020.01); C08J 7/044 (2020.01); C08K 3/20 (2013.01); H01L 23/3737 (2013.01); B29K 2083/00 (2013.01); B29K 2995/0013 (2013.01); C08J 2333/24 (2013.01); C08J 2483/04 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01);
Abstract

A thermally conductive sheet in which a cured layer of a thermally conductive silicone composition is laminated on one or both sides of a synthetic resin film layer of aromatic polyimide, etc. having excellent heat resistance, electrical insulation, and mechanical strength, wherein good thermal conductivity, good insulation, and strong interlayer adhesion are provided because the thermally conductive silicone composition includes 250 to 600 wt. % of an aspherical thermally conductive filler material, which contains no more than 80 ml/100 g of a DOP oil absorption amount and an organic silicon compound component including an adhesion imparting agent, relative to 100 wt. % of the organic silicon compound component, and moreover the thermally conductive sheet with no brittleness during use can be made using continuous molding.


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