The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2023

Filed:

May. 28, 2018
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventor:

Shinji Yamamoto, Suita, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B23K 20/04 (2006.01); B23K 103/04 (2006.01); B23K 103/12 (2006.01); B23K 103/22 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
B32B 15/015 (2013.01); B23K 20/04 (2013.01); B23K 2103/05 (2018.08); B23K 2103/12 (2018.08); B23K 2103/22 (2018.08); H05K 5/04 (2013.01);
Abstract

A clad material () includes a first layer () made of stainless steel, a second layer () made of Cu or a Cu alloy and roll-bonded to the first layer, and a third layer () made of stainless steel and roll-bonded to a side of the second layer opposite to the first layer. The clad material has an overall thickness of 1 mm or less, and in a cross-sectional view along a stacking direction, a minimum thickness of the first layer in the stacking direction and a minimum thickness of the third layer in the stacking direction are 70% or more and less than 100% of an average thickness of the first layer in the stacking direction and an average thickness of the third layer in the stacking direction, respectively.


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