The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2023
Filed:
Jun. 23, 2021
3m Innovative Properties Company, St. Paul, MN (US);
Carsten Franke, St. Paul, MN (US);
Maiken Givot, St. Paul, MN (US);
Malte Korten, Moorenweis, DE;
Robert L. W. Smithson, Mahtomedi, MN (US);
Brian D. Goers, Minneapolis, MN (US);
Negus B. Adefris, St. Paul, MN (US);
Thomas J. Anderson, Cottage Grove, MN (US);
Brian A. Shukla, Woodbury, MN (US);
Michael C. Harper, Hudson, WI (US);
Elizaveta Y. Plotnikov, St. Paul, MN (US);
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Abstract
A method of forming a vitreous bond abrasive article is presented that includes receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying a plurality of layers of a vitreous bond abrasive article precursor. The vitreous bond abrasive article precursor includes abrasive particles bonded together by a vitreous bond precursor material and an organic compound. The vitreous bond abrasive article precursor further comprises at least one of: at least one tortuous cooling channel extending at least partially through the vitreous bond abrasive article precursor or at least one arcuate cooling channel extending at least partially through the vitreous bond abrasive article precursor. The method also includes generating, with the manufacturing device by an additive manufacturing process, the vitreous bond abrasive article precursor based on the digital object.