The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Aug. 13, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Masakazu Mimura, Nagaokakyo, JP;

Yutaka Kishimoto, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/17 (2006.01); H03H 3/08 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02574 (2013.01); H03H 3/08 (2013.01); H03H 9/02086 (2013.01); H03H 9/02157 (2013.01); H03H 9/02228 (2013.01); H03H 9/175 (2013.01); H03H 9/25 (2013.01); H03H 9/6453 (2013.01);
Abstract

An elastic wave device includes a supporting substrate, an acoustic reflection layer on the supporting substrate, a piezoelectric layer on the acoustic reflection layer, and an IDT electrode on the piezoelectric layer. The acoustic reflection layer includes three or more low-acoustic impedance layers and two or more high-acoustic impedance layers. At least one of a first relationship in which in which, a film thickness of a first low-acoustic impedance layer closest to the piezoelectric layer is thinner than a film thickness of a low-acoustic impedance layer closest to the first low-acoustic impedance layer, and a second relationship in which a film thickness of a first high-acoustic impedance layer closest to the piezoelectric layer is thinner than a film thickness of a high-acoustic impedance layer closest to the first high-acoustic impedance layer, is satisfied.


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