The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2023
Filed:
Aug. 21, 2019
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Jeonghoon Kim, Gyeonggi-do, KR;
Sewoong Kim, Gyeonggi-do, KR;
Woosuk Kang, Gyeonggi-do, KR;
Museok Bang, Gyeonggi-do, KR;
Chaeup Yoo, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
According to various embodiments of the present invention, an electronic device may comprise: a housing comprising a first surface, a second surface oriented in the direction opposite from the first surface, and a side surface surrounding a space between the first surface and the second surface; a conductive member for forming at least a portion of the side surface; a display seen through the first surface and including a first conductive layer; a printed circuit board disposed to be spaced apart from the display between the display and the second surface in the housing, and including a second conductive layer in which at least a portion thereof faces the first conductive layer; a third conductive layer spaced apart from the display and the printed circuit board, disposed between the first conductive layer and the second conductive layer, and facing the first conductive layer; a support structure comprising a non-conductive plate which is formed between the third conductive layer and the printed circuit board and in which at least a portion thereof is in contact with the third conductive layer; a conductive pattern extending between the third conductive layer and the non-conductive plate and electrically connected to the second conductive layer; and a wireless communication circuit electrically connected to the conductive member and configured to transmit and/or receive an RF signal. Other various embodiments may be possible.