The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Jan. 28, 2021
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Jeong Ho Lee, Asan-si, KR;

Sang Hun Lee, Seoul, KR;

Za Il Lhee, Hwaseong-si, KR;

Min Ju Kim, Cheonan-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 27/14 (2006.01); H01L 27/32 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); G09G 2300/0408 (2013.01); G09G 2300/0804 (2013.01); H01L 27/14678 (2013.01); H01L 27/323 (2013.01); H01L 27/3251 (2013.01); H01L 2251/301 (2013.01);
Abstract

A display device includes: a base substrate including an active area, and a non-active area including a crack dam arrangement area; a plurality of inorganic layers on the base substrate; and an encapsulation layer on the plurality of inorganic layers, and including an encapsulation inorganic layer, and an encapsulation organic layer on the encapsulation inorganic layer. The base substrate includes first substrate portions having a first thickness at the crack dam arrangement area, and a second substrate portion between adjacent ones of the first substrate portions and connected to the first substrate portions, the second substrate portion having a second thickness smaller than the first thickness. The plurality of inorganic layers are laminated to form an inorganic laminated film at the crack dam arrangement area; and the encapsulation inorganic layer is located over the first substrate portions and the second substrate portion, and includes at least one short circuit portion.


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