The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Aug. 22, 2016
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Changseo Park, Seoul, KR;

Kiseong Jeon, Seoul, KR;

Jinhong Park, Seoul, KR;

Hwankuk Yuh, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/08 (2010.01); H01L 25/075 (2006.01); H01L 33/38 (2010.01); H05B 33/10 (2006.01); H05B 33/14 (2006.01); H05B 33/22 (2006.01); H05K 1/11 (2006.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/08 (2013.01); H01L 25/0753 (2013.01); H01L 33/382 (2013.01); H05B 33/10 (2013.01); H05B 33/14 (2013.01); H05B 33/22 (2013.01); H05K 1/111 (2013.01); H01L 33/44 (2013.01); H01L 33/502 (2013.01); H01L 33/62 (2013.01); H05K 2201/0145 (2013.01); Y02B 20/40 (2013.01);
Abstract

The present invention relates to a display device and, in particular, to a display device using a semiconductor light emitting diode. A display device according to the present invention comprises a substrate having a plurality of metal pads; and a plurality of semiconductor light emitting diodes electrically connected to the metal pads through self-assembly. The present invention is characterized in that: the semiconductor light emitting diodes respectively include a conductive semiconductor layer, a conductive electrode formed on one surface of the conductive semiconductor layer, and a passivation layer enclosing the semiconductor light emitting diode and provided with a through hole for exposing the conductive electrode; one end portion of the semiconductor light emitting diodes is divided into a first portion in which the conductive electrode is exposed, and a second portion in which the passivation layer is exposed; and the maximum width of the metal pad is set to a range of the width to twice the width of the second portion.


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