The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2023
Filed:
Jun. 19, 2020
Qualcomm Incorporated, San Diego, CA (US);
Je-Hsiung Lan, San Diego, CA (US);
Ranadeep Dutta, Del Mar, CA (US);
Jonghae Kim, San Diego, CA (US);
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
A three-dimensional integrated circuit (3DIC) and techniques for fabricating a 3DIC. An example semiconductor device generally includes an integrated circuit (IC) having a first plurality of pads coupled to components of the IC, wherein a first oxide material is disposed between the first plurality of pads, and a second plurality of pads, wherein at least a portion of the first plurality of pads is bonded to at least a portion of the second plurality of pads, and wherein a second oxide material is disposed between the second plurality of pads and is bonded to the first oxide material b. The semiconductor device may also include a substrate disposed above the second plurality of pads, one or more passive devices adjacent to the substrate, and one or more vias formed through the substrate, wherein at least one of the second plurality of pads is coupled to the one or more vias.