The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Mar. 17, 2021
Applicants:

Michael Krames, Austin, TX (US);

Bardia Pezeshki, Mountain View, CA (US);

Robert Kalman, Mountain View, CA (US);

Cameron Danesh, Mountain View, CA (US);

Inventors:

Michael Krames, Austin, TX (US);

Bardia Pezeshki, Mountain View, CA (US);

Robert Kalman, Mountain View, CA (US);

Cameron Danesh, Mountain View, CA (US);

Assignee:

AVICENATECH CORP., Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/06 (2010.01); H01L 33/62 (2010.01); H01L 33/58 (2010.01); H01L 33/10 (2010.01); H01L 33/32 (2010.01); H01L 33/22 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/06 (2013.01); H01L 33/10 (2013.01); H01L 33/22 (2013.01); H01L 33/32 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01);
Abstract

An LED array on a sapphire substrate may be mounted on a silicon interconnect chip, with LEDs of the array inserted into holes of waveguides on the silicon interconnect chip. The sapphire substrate and the silicon interconnect chip may both have microbumps for carrying electrical signals to or from the LEDs, and the sapphire substrate and silicon interconnect chip may be bonded together using the microbumps. The LEDs may be configured to preferentially emit light in a lateral direction, for increased coupling of light into the waveguides.


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