The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

May. 26, 2020
Applicant:

Chaoyang Semiconductor Jiangyin Technology Co., Ltd., Jiangyin, CN;

Inventor:

Taner Dosluoglu, New York, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H05K 3/34 (2006.01); H01L 27/02 (2006.01); H01L 25/065 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H05K 3/3436 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 27/0203 (2013.01); H01L 27/092 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/17177 (2013.01); H01L 2224/81191 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19103 (2013.01);
Abstract

A scalable switching regulator architecture may include an integrated inductor. The integrated inductor may include vias or pillars in a multi-layer substrate, with selected vias coupled at one end by a redistribution layer of the multi-layer substrate and, variously, coupled at another end by a metal layer of a silicon integrated circuit chip or by a further redistribution layer of the multi-layer substrate. The vias may be coupled to the silicon integrated circuit chip by micro-balls, with the vias and micro-balls arranged in arrays.


Find Patent Forward Citations

Dosluoglu, Taner. (2023). Switched power stage with integrated passive components (U.S. Patent No. 11605580). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11605580

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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