The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2023
Filed:
Mar. 06, 2020
Applicant:
Mahle International Gmbh, Stuttgart, DE;
Inventors:
Francisco Gonzalez Espin, Elche, ES;
Torbjorn Hallberg, Valencia, ES;
Jose Antonio Castillo, San Antonio de Benageber, ES;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 23/34 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4087 (2013.01); H05K 2201/10 (2013.01); H05K 2201/10598 (2013.01);
Abstract
The present disclosure concerns a mounting device for semiconductor packages, and a heat dissipation assembly with such a mounting device. The mounting device includes a bottom side comprising one or more cavities to house semiconductor packages, and a top side comprising a plurality of holes extending from the bottom side to the top side for accommodating contact pins of the semiconductor packages. A fixation mechanism fixes the mounting device to a heat dissipation structure.