The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2023
Filed:
Jun. 03, 2021
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Takuya Takahashi, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/049 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/049 (2013.01); H01L 21/4817 (2013.01); H01L 23/3735 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 23/3672 (2013.01); H01L 25/18 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A semiconductor apparatus includes: an insulating substrate including a circuit pattern; a semiconductor device mounted on the insulating substrate and electrically connected to the circuit pattern; a case storing the insulating substrate and the semiconductor device; and an electrode attached to the case, wherein a tip surface of the electrode is jointed to the circuit pattern with solder, the electrode is brought into contact with and pushed against the circuit pattern by the case, and a projection is provided on the tip surface.